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These conditions detract from proper blade contact with lead and pad combinations and are indicative of poor hot-bar design or poor choice of materials. Blade warpage, if the curvature is sufficiently large, may result in solder opens. There have been many solutions proposed in the realm of structure, materials of construction, and electrical input to permit highest uniformity of blade heating and contact to the bonding pads. D. Waller et al.25 have patented a rigid molybdenum truss blade that has been found to be stable dimensionally and thermally uniform over long spans (in excess of 76 mm). Usually the hot-bar blade is attached to a self-leveling, spring-loaded bonding head that allows the blade to self-planarize in relation to the underlying component leads and circuit board surface. Nonetheless, variations in board contour, such as a localized high or low spot, can render the concept of self-planarization useless and solder opens can result. Rigid-member hot-bars are excellent for accommodating differences in lead coplanarity because the blade

force and pressure control and engine knock detection for a higher power output are a few of the more commonly used microsensors [6, 12] The manifold absolute pressure (MAP) sensor was one of the first microsensors adopted by the automotive industry way back in the early 1980s It monitors the manifold absolute pressure and engine speed to optimize the power performance of the engine by controlling the air and fuel ratio For comfort and convenience, various MEMS devices such as displacement sensors, airflow, humidity, temperature and microvalves are used for achieving seat control, the rider s comfort, as a security measure, sensors for defogging of windshields and satellite navigation purposes In terms of vehicle diagnostics and health monitoring, engine coolant temperature and quality, engine oil pressure,

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forces lead to pad. Driving a heavily sprung lead onto its corresponding bonding pad can, however, lock stress into the resultant solder joint because the solder is working to resist the spring force of the lead. This can detract from the joint reliability and cause premature joint failure.

Maintenance and Diagnostic Methods As with any process equipment, it is important to maintain the hot-bar properly. Check it frequently for distortion. Ensure that it remains flat and perpendicular to the circuit board to be bonded. Scrub the hot-bar on a ceramic flat to remove any baked-on flux residue. This may need to be done every few bonding cycles, depending on the flux and the criticality of the assembly. Several diagnostic tools can be applied to assess hot-bar conditions. The two most important characteristics that must be understood and monitored are thermal performance and blade planarity.

Thermal Monitoring One of the most common methods of assessing hot-bar performance is to use a thermocoupleinstrumented board, as is the case with any other soldering method. Preparing such a board for thermode use has its own requirements. Fine-gauge thermocouples are attached to leads of the component or the bonding pad of the circuit board to be soldered. Positioning thermocouples at both ends of the lead set and also near its center helps quantify the longitudinal thermal uniformity of hot-bar performance during soldering. It is also useful to deploy thermocouples on surrounding components to ensure that the hot-bar soldering process does not jeopardize the integrity of adjacent, previously soldered joints. When preparing the thermal profile board for hot-bar soldering, avoid placing the thermocouple bead(s) between component lead and bonding pad.The added height of the bead would prevent the bar from contacting adjacent component leads and results in point-contact heating that is not indicative of the bar s normal operation. Instead, place the thermocouple bead at the pad extension area in front of the lead tip or at the lead heel as indicated in Fig. 47.40.

FIGURE 47.40 Just as in any other soldering method, a thermal profile board is needed for hot-bar soldering. Care must be taken that the thermocouple bead does not interfere with seating of the lead to pad or with the hot-bar blade to the lead and pad combination (a, b). Instead, the thermocouple can be attached with a hightemperature solder alloy in front of or behind the component lead (c) so that a common lead, pad, and bar seating plane is maintained.

STOP condition. Figure 6.28 illustrates how to connect up to 4 MAX521s on a single bus from the host. The four devices are distinguished by the different addresses set on the AD0 and AD1 lines. Each of the MAX521 compares these bits with the address bits in the address byte transmission from the host. Figure 6.29 illustrates how an AT90S2313 AVR processor can be connected to a MAX521 DAC to provide up to 8 channels of 8-bit DAC. The I2C protocol that the MAX521 DAC understands can be created on any I/O line of the processor, and the processor can communicate to the MAX521 chip under software control.

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