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Solder Application The use of solder paste is discouraged because blade heatup is fast and may result in explosive solder ball formation from rapidly volatilized paste constituents. Also, the paste is likely to squeeze out from between the component lead and circuit board pad, which can cause the solder to bridge to adjacent conductors. In fact, even with solid solder coatings on the circuit board, bridging can be problematic in hot-bar bonding. This is usually a function of the volume of solder on the pad, the quantity of flux, its degree of activity, and lead-pad pitch. As the

solder is melted and displaced by the hot-bar, it bulges laterally to the point that the solder masses of two or more adjacent pads may touch one another, forming a solder bridge. Once the bridge has formed, the forces associated with lead-pad wetting and capillarity may not be strong enough to overcome the surface tension conditions established during bridge formation. If that is the case, the bridging defect(s) will persist (Fig. 47.37).

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DAC0 voltage output DAC1 voltage output DAC2 voltage output DAC3 voltage output DAC4 voltage output DAV5 voltage output DAC6 voltage output DAC7 voltage output Reference voltage input for DAC0 Reference voltage input for DAC1 Reference voltage input for DAC2 Reference voltage input for DAC3 Reference voltage input for DACs 4, 5, 6, and 7 Serial Clock input Serial Data input Address input 0. Sets IC s slave address Address input 1. Sets IC s slave address Power supply, Digital ground Analog ground 5 volts

FIGURE 47.37 As the hot-bar is forced into contact with component leads and circuit board pads (a), the solder may bulge laterally as shown in (b), resulting in solder bridges (c). Careful control of solder volume, applied pressure, and temperature profile during hot-bar soldering is required to preclude this defect.

comb-like structure in which cantilevered beams are interdigitated with a row of electrically charged fixed plates that are deposited on a silicon wafer The beams are also joined to form a single suspended frame, which deflects on the chip in response to acceleration An increase or a decrease in the speed makes the beams vibrate between the fixed plates, generating changes in capacitance between the separate structures These changes are sensed electrically and processed by using control electronics, which calculate how much voltage is needed to keep the beams from moving The voltage is proportional to the acceleration or deceleration the sensor is experiencing and is applied to the cantilevered beams as a balance [9] The application of the accelerometer is not only limited to the air-bag system It can be also used as antilock braking systems, active suspensions or disk drives for portable computers Other microsystems for the purpose of safety in an automobile include microgyroscopes for navigation and pressure and displacement sensors for object avoidance In an automobile engine, manifold control with pressure sensors, airflow control, exhaust gas analysis and control, crankshaft positioning, fuel pump pressure and fuel injection control, transmission

Solid solder coatings such as hot air-leveled pads, solder-plated boards, or stenciled solder paste reflowed prior to hot-bar bonding are preferred for this bonding method. 47.10.2 Fluxes and Fluxing for Hot-Bar Soldering Soldering flux is applied prior to component placement and soldering. Flux choice should be tailored to the hot-bar process. The flux can be either liquid or paste. The flux chosen should be tested to resist charring and the development of polymerized decomposition products, or lacquers, which adhere to both circuit board and hot-bar. Residue build-up on the bar can adversely inhibit hot-bar performance by diminishing thermal transfer. The residue can also become thick and uneven enough to prevent the hot-bar from squarely contacting component leads. Baked-on aqueous-clean flux residues can make flux cleaning difficult.With no-clean flux, overheated residues may detract from the visual appearance of the printed circuit assembly. 47.10.3 The Hot-Bar Soldering Operation Generally, the board is preheated on a hot stage beneath the hot-bar, off to the side or even in a box oven prior to soldering. Sometimes hot air is used for preheating. This step is generally done after flux application, so the thermal profile has to be adjusted to prevent flux dry-out. Once component leads are aligned with solder-coated PWB pads, the hot-bar is pressed against

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